AMD Ryzen 9 7945HX3D
59124Benchmark
Single Thread Rating: 4170
Samples: 27*
Margin for error: Low
5.4 GHzboost
Dragon Rangecodename
16cores
2.3 GHZfrequency
AMD Socket FL1socket
55 Wtdp
32threads
The AMD Ryzen 9 7945HX3D is a mobile processor with 16 cores, launched in July 2023. It is part of the Ryzen 9 lineup, using the Zen 4 (Dragon Range) architecture with Socket FL1. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 32 threads. Ryzen 9 7945HX3D has 128 MB of L3 cache and operates at 2.3 GHz by default, but can boost up to 5.4 GHz, depending on the workload. AMD is building the Ryzen 9 7945HX3D on a 5 nm production process using 17,840 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. You may freely adjust the unlocked multiplier on Ryzen 9 7945HX3D, which simplifies overclocking greatly, as you can easily dial in any overclocking frequency. With a TDP of 55 W, the Ryzen 9 7945HX3D consumes typical power levels for a modern PC. AMD's processor supports DDR5 memory with a dual-channel interface. The highest officially supported memory speed is 5200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the machine, Ryzen 9 7945HX3D uses a PCI-Express Gen 5 connection. This processor features the Radeon 610M integrated graphics solution. Hardware virtualization is available on the Ryzen 9 7945HX3D, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.
- Socket: AMD Socket FL1
- Foundry: TSMC
- Process Size: 5 nm
- Transistors: 17,840 million
- Die Size: 2x 71 mm²
- I/O Process Size: 6 nm
- I/O Die Size: 122 mm²
- Package: µFC-BGAFL1
- tJMax: 100°C
- Market: Mobile
- Production Status: Active
- Release Date: Jul 27th, 2023
- Part#: 100-000001086
- Frequency: 2.3 GHz
- Turbo Clock: up to 5.4 GHz
- Base Clock: 100 MHz
- Multiplier: 23.0x
- Multiplier Unlocked: Yes
- TDP: 55 W
- PPT: 55-75 W
- Codename: Dragon Range
- Generation: Ryzen 9 (Zen 4 (Dragon Range))
- Memory Support: DDR5
- Rated Speed: 5200 MT/s
- Memory Bus: Dual-channel
- ECC Memory: Yes
- PCI-Express: Gen 5, 28 Lanes(CPU only)
- # of Cores: 16
- # of Threads: 32
- SMP # CPUs: 1
- Integrated Graphics: Radeon 610M
- Cache L1: 64 KB (per core)
- Cache L2: 1 MB (per core)
- Cache L3: 128 MB (shared)
- 3D V-Cache: 1x 64MB Slice
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